Maximum process capability

﹡Circuit board layers: 1-20 layers

﹡Minimum line width / space： 3mil/3mil

﹡Min drilling range： 0.15mm，laser 0.1mm

﹡Finished plate thickness： 0.20-7.0mm

﹡Impedance control range： + - 10%

﹡Surface treatment method: Hot air leveling, chemical immersion gold, silver, gold finger, full plate gold plating, lead-free tin spray、OSP

﹡Aperture ratio： 1：12

Long-term, on-time, and fast delivery capabilities Fast delivery templates can support your R & D process for a long time

1、2-6 floors (1-5 days)

2、8-10 floors (5-7 days)

3、12-20 floors (7-10 days)