Min. Line Width/Space: 3mils/3mils(0.076mm/0.076mm)

Min. Annular Ring Width: 3mils(0.076mm)

Min. Hole Size: 8mils(0.2mm)

Max. Board Thickness: 6.0mm

Aspect ratio ≤10：1

Max. copper weight: inner layer 5OZ(175um), outer layer 7OZ(245um)

Max. Board Size: 2 layer 600×800mm, multilayers 500 ×800mm

Layer coverage: 4-20 layer

Min. Blind/Buried-via: 8mils(0.2mm)

Impedance Control: +/-10%

Surface technique: Immersion gold/tin, Electrolytic Ni/Au, Gold finger, OSP